Remember to use 1 or 2 thicknesses of a manila folder (approx. 0.006†per thickness or 0.012†maximum) to space off the boards from the top rim of your caps when soldering the boards to the snap in tabs. It does 2 things:
Allows for thermal expansion of the cap and the board without putting stress on the snap in leads, the board or abrading the solder mask and can insulator.
Prevent the heat of soldering the snap in tabs and downstream expansion wires from melting the can insulator and having a short develop over time.
[attachment=1:2zp9h7hs]New_Cap_1.JPG[/attachment:2zp9h7hs]
When using a piggyback cap, I put a 0.020†thick plastic spacer shim between the top of the piggybacked cap board and the bottom of the primary cap can during the soldering operation for the 16AWG expansion wires from the primary to piggybacked cap. This allows for thermal expansion and avoidance of any contact of the piggybacked board solder connections with the plastic insulator on the bottom of the primary cap. I always prefer air as an insulator over relying on other insulating material. You can see this shim (black) in the photo below.
[attachment=0:2zp9h7hs]New_Cap_5.JPG[/attachment:2zp9h7hs]
Contrary to the picture above, I always put the shorter of the 2 caps on the front board with the terminals as this keeps the interconnect wires shorter.