The one segment of the backplane that is visible in the bottom most photo has some concerns for me. Usually on the PEM nut standoffs that are soldered into the backside of the board have vestiges of molten solder showing around the periphery of each PEM nut on the front side of the board. In the photo, I see none. That leads me to the concern that perhaps the joints on the back side were not reflowed enough and possibly are no longer attached. Something to check out. The meniscus around each of the socket cups for the 2 transistor leads shows evidence of cold solder. Those are relatively easy to solder, the PEM nuts are not easy to solder. The same type of cold solder is evidenced on the bus bar that has wires reflowed to it. It takes a lot of heat to solder joints like those properly and in this case, not enough was applied.
I am not trying to be critical. Rather trying to point out areas that concern me that you should investigate. May turn out be something, or may be nothing.
Last, the Backplane Kits are VERY DIFFICULT to assemble correctly due to the sheer mass of copper in each backplane board (for a reason). It says so in BOLD RED TYPE at the very start of the instructions.
The clear photos should help a bunch.